Merge tag 'trace-v7.3-2' of git://git.kernel.org/pub/scm/linux/kernel/git/trace/linux-tracegrafted

Pull tracing fixes from Steven Rostedt:

 - Fix error output of boot instance creation failure

   Currently if a boot instance creation fails, instead of printing out
   the name of the instance that failed, it prints "(null)". That is
   because it prints "cur_str" that had already been processed by
   strsep(). Print the saved name instead.

   While at it, print the error code of the failure.

 - Fix use-after-free for same named historgrams

   Histograms can be named so that they can be used in multiple events.
   But if the named histogram has a variable attached, the second event
   that uses the named histogram which duplicates it and needs to free
   the original after duplication leaves the old variable in place and
   still visible. If another histogram uses than variable, it will use
   the stale one which will try to reference the freed duplicate
   histogram and crash the kernel.

   Free the duplicate variables along with the duplicated histogram
   data.

 - Check return value of kthread_run() in event self test

   The events self tests uses a kthread for testing but does not check
   if it succeeded in creating a kthread. If the kthread creation were
   to fail, the code will still try to call kthread_stop() on the error
   returned.

 - Fix race between reading trace_pipe and updating subbuffer size

   If a user is reading the trace_pipe file at the same time they update
   the ring buffer sub-buffer size, can cause the trace_pipe read to
   read stale data. Add trace_access_lock() around updating the ring
   buffer sub-buffer size.

 - Fix eventfs_inode on failure path in creation of the events directory

   In the creation of the "events" directory, if after allocating the
   eventfs_inode a failure is detected, it calls cleanup_ei() which
   calls free_ei(). The free_ei() will test if eventfs_inode being freed
   has no children. It is a bug if it does. But on the failure case of
   the creation of the "events" directory, the children lists have not
   yet been initialized and the free will trigger a warning because
   list_empty() on an uninitialized list returns false.

   Move the initialization into init_ei() where it makes more sense and
   makes sure that a created eventfs_inode has its lists initialized
   upon creation.

 - Check return value of kthread_run() in ftrace direct sample code

   The sample code that shows how to use the ftrace direct calls does
   not test the return of kthread_run() to see if it succeeds. Return a
   failure if the kthread_run() doesn't succeed.

 - Clear user events state on fork in case of alloc failure

   On fork, the child gets a pointer to the parent's user events state.
   It makes a copy of it then updates the child's pointer to it. But if
   the allocation fails, the duplication function leaves the child with
   a pointer to its parent's descriptor. When the child cleans up its
   data, it will free the parent's descriptor while the parent is still
   using it.

   In the duplication function, set the child's user_event_mm to NULL
   before testing if the allocation succeeded, and when it exits it will
   not free the parent's descriptor.

 - Fix retry exhaustion in simple ring buffer reader swap

   simple_ring_buffer_swap_reader_page() starts with retry set to 8 and
   post-decrements it only after a failed link replacement. On the final
   attempt, a successful replacement leaves retry at zero, while a
   failed replacement leaves it at -1.

   But the check for success expects the retry value to be non-zero and
   exits with an error on zero. This is the opposite result. Fix it.

 - Fail nicely when the remote swap_reader_page() returns an error

   Currently, if the swap_reader_page() of a remote buffer fails, it
   triggers a WARN_ON_ONCE() and continues normally. Instead, have it
   exit with an error and a pr_warn() print instead of a full WARNING.

* tag 'trace-v7.3-2' of git://git.kernel.org/pub/scm/linux/kernel/git/trace/linux-trace:
  ring-buffer: Stop remote reader update when page swap fails
  tracing: Fix retry exhaustion in simple ring buffer reader swap
  tracing/user_events: Clear copied tracing state before fork duplication
  samples/ftrace: Fix kthread_stop() on ERR_PTR in ftrace-direct-multi-modify
  samples/ftrace: Fix kthread_stop() on ERR_PTR in ftrace-direct-modify
  eventfs: Initialize ei->children and ei->list in init_ei()
  tracing: Fix use-after-free in trace_pipe read on sub-buffer order change
  tracing: Fix crash passing ERR_PTR to kthread_stop()
  tracing: Fix use-after-free with same-name named triggers
  tracing: Fix logged instance name on creation failure

10 files changed, 1778 insertions, 0 deletions

diff --git a/Documentation/driver-api/thermal/cpu-cooling-api.rst b/Documentation/driver-api/thermal/cpu-cooling-api.rst
new file mode 100644
index 000000000..645d914c4
--- /dev/null
+++ b/Documentation/driver-api/thermal/cpu-cooling-api.rst
@@ -0,0 +1,107 @@
+=======================
+CPU cooling APIs How To
+=======================
+
+Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>
+
+Updated: 6 Jan 2015
+
+Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
+
+0. Introduction
+===============
+
+The generic cpu cooling(freq clipping) provides registration/unregistration APIs
+to the caller. The binding of the cooling devices to the trip point is left for
+the user. The registration APIs returns the cooling device pointer.
+
+1. cpu cooling APIs
+===================
+
+1.1 cpufreq registration/unregistration APIs
+--------------------------------------------
+
+    ::
+
+	struct thermal_cooling_device
+	*cpufreq_cooling_register(struct cpumask *clip_cpus)
+
+    This interface function registers the cpufreq cooling device with the name
+    "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
+    cooling devices.
+
+   clip_cpus:
+	cpumask of cpus where the frequency constraints will happen.
+
+    ::
+
+	struct thermal_cooling_device
+	*of_cpufreq_cooling_register(struct cpufreq_policy *policy)
+
+    This interface function registers the cpufreq cooling device with
+    the name "thermal-cpufreq-%x" linking it with a device tree node, in
+    order to bind it via the thermal DT code. This api can support multiple
+    instances of cpufreq cooling devices.
+
+    policy:
+	CPUFreq policy.
+
+
+    ::
+
+	void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+
+    This interface function unregisters the "thermal-cpufreq-%x" cooling device.
+
+    cdev: Cooling device pointer which has to be unregistered.
+
+2. Power models
+===============
+
+The power API registration functions provide a simple power model for
+CPUs.  The current power is calculated as dynamic power (static power isn't
+supported currently).  This power model requires that the operating-points of
+the CPUs are registered using the kernel's opp library and the
+`cpufreq_frequency_table` is assigned to the `struct device` of the
+cpu.  If you are using CONFIG_CPUFREQ_DT then the
+`cpufreq_frequency_table` should already be assigned to the cpu
+device.
+
+The dynamic power consumption of a processor depends on many factors.
+For a given processor implementation the primary factors are:
+
+- The time the processor spends running, consuming dynamic power, as
+  compared to the time in idle states where dynamic consumption is
+  negligible.  Herein we refer to this as 'utilisation'.
+- The voltage and frequency levels as a result of DVFS.  The DVFS
+  level is a dominant factor governing power consumption.
+- In running time the 'execution' behaviour (instruction types, memory
+  access patterns and so forth) causes, in most cases, a second order
+  variation.  In pathological cases this variation can be significant,
+  but typically it is of a much lesser impact than the factors above.
+
+A high level dynamic power consumption model may then be represented as::
+
+	Pdyn = f(run) * Voltage^2 * Frequency * Utilisation
+
+f(run) here represents the described execution behaviour and its
+result has a units of Watts/Hz/Volt^2 (this often expressed in
+mW/MHz/uVolt^2)
+
+The detailed behaviour for f(run) could be modelled on-line.  However,
+in practice, such an on-line model has dependencies on a number of
+implementation specific processor support and characterisation
+factors.  Therefore, in initial implementation that contribution is
+represented as a constant coefficient.  This is a simplification
+consistent with the relative contribution to overall power variation.
+
+In this simplified representation our model becomes::
+
+	Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation
+
+Where `capacitance` is a constant that represents an indicative
+running time dynamic power coefficient in fundamental units of
+mW/MHz/uVolt^2.  Typical values for mobile CPUs might lie in range
+from 100 to 500.  For reference, the approximate values for the SoC in
+ARM's Juno Development Platform are 530 for the Cortex-A57 cluster and
+140 for the Cortex-A53 cluster.
diff --git a/Documentation/driver-api/thermal/cpu-idle-cooling.rst b/Documentation/driver-api/thermal/cpu-idle-cooling.rst
new file mode 100644
index 000000000..c2a7ca676
--- /dev/null
+++ b/Documentation/driver-api/thermal/cpu-idle-cooling.rst
@@ -0,0 +1,199 @@
+.. SPDX-License-Identifier: GPL-2.0
+
+================
+CPU Idle Cooling
+================
+
+Situation:
+----------
+
+Under certain circumstances a SoC can reach a critical temperature
+limit and is unable to stabilize the temperature around a temperature
+control. When the SoC has to stabilize the temperature, the kernel can
+act on a cooling device to mitigate the dissipated power. When the
+critical temperature is reached, a decision must be taken to reduce
+the temperature, that, in turn impacts performance.
+
+Another situation is when the silicon temperature continues to
+increase even after the dynamic leakage is reduced to its minimum by
+clock gating the component. This runaway phenomenon can continue due
+to the static leakage. The only solution is to power down the
+component, thus dropping the dynamic and static leakage that will
+allow the component to cool down.
+
+Last but not least, the system can ask for a specific power budget but
+because of the OPP density, we can only choose an OPP with a power
+budget lower than the requested one and under-utilize the CPU, thus
+losing performance. In other words, one OPP under-utilizes the CPU
+with a power less than the requested power budget and the next OPP
+exceeds the power budget. An intermediate OPP could have been used if
+it were present.
+
+Solutions:
+----------
+
+If we can remove the static and the dynamic leakage for a specific
+duration in a controlled period, the SoC temperature will
+decrease. Acting on the idle state duration or the idle cycle
+injection period, we can mitigate the temperature by modulating the
+power budget.
+
+The Operating Performance Point (OPP) density has a great influence on
+the control precision of cpufreq, however different vendors have a
+plethora of OPP density, and some have large power gap between OPPs,
+that will result in loss of performance during thermal control and
+loss of power in other scenarios.
+
+At a specific OPP, we can assume that injecting idle cycle on all CPUs
+belong to the same cluster, with a duration greater than the cluster
+idle state target residency, we lead to dropping the static and the
+dynamic leakage for this period (modulo the energy needed to enter
+this state). So the sustainable power with idle cycles has a linear
+relation with the OPP’s sustainable power and can be computed with a
+coefficient similar to::
+
+	    Power(IdleCycle) = Coef x Power(OPP)
+
+Idle Injection:
+---------------
+
+The base concept of the idle injection is to force the CPU to go to an
+idle state for a specified time each control cycle, it provides
+another way to control CPU power and heat in addition to
+cpufreq. Ideally, if all CPUs belonging to the same cluster, inject
+their idle cycles synchronously, the cluster can reach its power down
+state with a minimum power consumption and reduce the static leakage
+to almost zero.  However, these idle cycles injection will add extra
+latencies as the CPUs will have to wakeup from a deep sleep state.
+
+We use a fixed duration of idle injection that gives an acceptable
+performance penalty and a fixed latency. Mitigation can be increased
+or decreased by modulating the duty cycle of the idle injection.
+
+::
+
+     ^
+     |
+     |
+     |-------                         -------
+     |_______|_______________________|_______|___________
+
+     <------>
+       idle  <---------------------->
+                    running
+
+      <----------------------------->
+              duty cycle 25%
+
+
+The implementation of the cooling device bases the number of states on
+the duty cycle percentage. When no mitigation is happening the cooling
+device state is zero, meaning the duty cycle is 0%.
+
+When the mitigation begins, depending on the governor's policy, a
+starting state is selected. With a fixed idle duration and the duty
+cycle (aka the cooling device state), the running duration can be
+computed.
+
+The governor will change the cooling device state thus the duty cycle
+and this variation will modulate the cooling effect.
+
+::
+
+     ^
+     |
+     |
+     |-------                 -------
+     |_______|_______________|_______|___________
+
+     <------>
+       idle  <-------------->
+                running
+
+      <--------------------->
+          duty cycle 33%
+
+
+     ^
+     |
+     |
+     |-------         -------
+     |_______|_______|_______|___________
+
+     <------>
+       idle  <------>
+              running
+
+      <------------->
+       duty cycle 50%
+
+The idle injection duration value must comply with the constraints:
+
+- It is less than or equal to the latency we tolerate when the
+  mitigation begins. It is platform dependent and will depend on the
+  user experience, reactivity vs performance trade off we want. This
+  value should be specified.
+
+- It is greater than the idle state’s target residency we want to go
+  for thermal mitigation, otherwise we end up consuming more energy.
+
+Power considerations
+--------------------
+
+When we reach the thermal trip point, we have to sustain a specified
+power for a specific temperature but at this time we consume::
+
+ Power = Capacitance x Voltage^2 x Frequency x Utilisation
+
+... which is more than the sustainable power (or there is something
+wrong in the system setup). The ‘Capacitance’ and ‘Utilisation’ are a
+fixed value, ‘Voltage’ and the ‘Frequency’ are fixed artificially
+because we don’t want to change the OPP. We can group the
+‘Capacitance’ and the ‘Utilisation’ into a single term which is the
+‘Dynamic Power Coefficient (Cdyn)’ Simplifying the above, we have::
+
+ Pdyn = Cdyn x Voltage^2 x Frequency
+
+The power allocator governor will ask us somehow to reduce our power
+in order to target the sustainable power defined in the device
+tree. So with the idle injection mechanism, we want an average power
+(Ptarget) resulting in an amount of time running at full power on a
+specific OPP and idle another amount of time. That could be put in a
+equation::
+
+ P(opp)target = ((Trunning x (P(opp)running) + (Tidle x P(opp)idle)) /
+			(Trunning + Tidle)
+
+  ...
+
+ Tidle = Trunning x ((P(opp)running / P(opp)target) - 1)
+
+At this point if we know the running period for the CPU, that gives us
+the idle injection we need. Alternatively if we have the idle
+injection duration, we can compute the running duration with::
+
+ Trunning = Tidle / ((P(opp)running / P(opp)target) - 1)
+
+Practically, if the running power is less than the targeted power, we
+end up with a negative time value, so obviously the equation usage is
+bound to a power reduction, hence a higher OPP is needed to have the
+running power greater than the targeted power.
+
+However, in this demonstration we ignore three aspects:
+
+ * The static leakage is not defined here, we can introduce it in the
+   equation but assuming it will be zero most of the time as it is
+   difficult to get the values from the SoC vendors
+
+ * The idle state wake up latency (or entry + exit latency) is not
+   taken into account, it must be added in the equation in order to
+   rigorously compute the idle injection
+
+ * The injected idle duration must be greater than the idle state
+   target residency, otherwise we end up consuming more energy and
+   potentially invert the mitigation effect
+
+So the final equation is::
+
+ Trunning = (Tidle - Twakeup ) x
+		(((P(opp)dyn + P(opp)static ) - P(opp)target) / P(opp)target )
diff --git a/Documentation/driver-api/thermal/exynos_thermal.rst b/Documentation/driver-api/thermal/exynos_thermal.rst
new file mode 100644
index 000000000..764df4ab5
--- /dev/null
+++ b/Documentation/driver-api/thermal/exynos_thermal.rst
@@ -0,0 +1,90 @@
+========================
+Kernel driver exynos_tmu
+========================
+
+Supported chips:
+
+* ARM Samsung Exynos4, Exynos5 series of SoC
+
+  Datasheet: Not publicly available
+
+Authors: Donggeun Kim <dg77.kim@samsung.com>
+Authors: Amit Daniel <amit.daniel@samsung.com>
+
+TMU controller Description:
+---------------------------
+
+This driver allows to read temperature inside Samsung Exynos4/5 series of SoC.
+
+The chip only exposes the measured 8-bit temperature code value
+through a register.
+Temperature can be taken from the temperature code.
+There are three equations converting from temperature to temperature code.
+
+The three equations are:
+  1. Two point trimming::
+
+	Tc = (T - 25) * (TI2 - TI1) / (85 - 25) + TI1
+
+  2. One point trimming::
+
+	Tc = T + TI1 - 25
+
+  3. No trimming::
+
+	Tc = T + 50
+
+  Tc:
+       Temperature code, T: Temperature,
+  TI1:
+       Trimming info for 25 degree Celsius (stored at TRIMINFO register)
+       Temperature code measured at 25 degree Celsius which is unchanged
+  TI2:
+       Trimming info for 85 degree Celsius (stored at TRIMINFO register)
+       Temperature code measured at 85 degree Celsius which is unchanged
+
+TMU(Thermal Management Unit) in Exynos4/5 generates interrupt
+when temperature exceeds pre-defined levels.
+The maximum number of configurable threshold is five.
+The threshold levels are defined as follows::
+
+  Level_0: current temperature > trigger_level_0 + threshold
+  Level_1: current temperature > trigger_level_1 + threshold
+  Level_2: current temperature > trigger_level_2 + threshold
+  Level_3: current temperature > trigger_level_3 + threshold
+
+The threshold and each trigger_level are set
+through the corresponding registers.
+
+When an interrupt occurs, this driver notify kernel thermal framework
+with the function exynos_report_trigger.
+Although an interrupt condition for level_0 can be set,
+it can be used to synchronize the cooling action.
+
+TMU driver description:
+-----------------------
+
+The exynos thermal driver is structured as::
+
+					Kernel Core thermal framework
+				(thermal_core.c, step_wise.c, cpufreq_cooling.c)
+								^
+								|
+								|
+  TMU configuration data -----> TMU Driver  <----> Exynos Core thermal wrapper
+  (exynos_tmu_data.c)	      (exynos_tmu.c)	   (exynos_thermal_common.c)
+  (exynos_tmu_data.h)	      (exynos_tmu.h)	   (exynos_thermal_common.h)
+
+a) TMU configuration data:
+		This consist of TMU register offsets/bitfields
+		described through structure exynos_tmu_registers. Also several
+		other platform data (struct exynos_tmu_platform_data) members
+		are used to configure the TMU.
+b) TMU driver:
+		This component initialises the TMU controller and sets different
+		thresholds. It invokes core thermal implementation with the call
+		exynos_report_trigger.
+c) Exynos Core thermal wrapper:
+		This provides 3 wrapper function to use the
+		Kernel core thermal framework. They are exynos_unregister_thermal,
+		exynos_register_thermal and exynos_report_trigger.
diff --git a/Documentation/driver-api/thermal/exynos_thermal_emulation.rst b/Documentation/driver-api/thermal/exynos_thermal_emulation.rst
new file mode 100644
index 000000000..c679502f0
--- /dev/null
+++ b/Documentation/driver-api/thermal/exynos_thermal_emulation.rst
@@ -0,0 +1,61 @@
+=====================
+Exynos Emulation Mode
+=====================
+
+Copyright (C) 2012 Samsung Electronics
+
+Written by Jonghwa Lee <jonghwa3.lee@samsung.com>
+
+Description
+-----------
+
+Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
+management unit. Thermal emulation mode supports software debug for
+TMU's operation. User can set temperature manually with software code
+and TMU will read current temperature from user value not from sensor's
+value.
+
+Enabling CONFIG_THERMAL_EMULATION option will make this support
+available. When it's enabled, sysfs node will be created as
+/sys/devices/virtual/thermal/thermal_zone'zone id'/emul_temp.
+
+The sysfs node, 'emul_node', will contain value 0 for the initial state.
+When you input any temperature you want to update to sysfs node, it
+automatically enable emulation mode and current temperature will be
+changed into it.
+
+(Exynos also supports user changeable delay time which would be used to
+delay of changing temperature. However, this node only uses same delay
+of real sensing time, 938us.)
+
+Exynos emulation mode requires that value changes and enabling are performed
+synchronously. This means that when you want to update any value, such as the
+delay or the next temperature, you must enable emulation mode at the same
+time (or keep the mode enabled). If you do not, the value will fail to update
+and the last successful value will continue to be used. For this reason,
+this node only allows users to change the temperature. Providing a single
+interface makes it simpler to use.
+
+Disabling emulation mode only requires writing value 0 to sysfs node.
+
+::
+
+
+  TEMP	120 |
+	    |
+	100 |
+	    |
+	 80 |
+	    |				 +-----------
+	 60 |      			 |	    |
+	    |		   +-------------|          |
+	 40 |              |         	 |          |
+	    |		   |		 |          |
+	 20 |		   |		 |          +----------
+	    |		   |		 |          |          |
+	  0 |______________|_____________|__________|__________|_________
+		   A		 A	    A		       A     TIME
+		   |<----->|	 |<----->|  |<----->|	       |
+		   | 938us |  	 |	 |  |       |          |
+  emulation   : 0  50	   |  	 70      |  20      |          0
+  current temp:   sensor   50		 70         20	      sensor
diff --git a/Documentation/driver-api/thermal/index.rst b/Documentation/driver-api/thermal/index.rst
new file mode 100644
index 000000000..a88602801
--- /dev/null
+++ b/Documentation/driver-api/thermal/index.rst
@@ -0,0 +1,19 @@
+.. SPDX-License-Identifier: GPL-2.0
+
+=======
+Thermal
+=======
+
+.. toctree::
+   :maxdepth: 1
+
+   cpu-cooling-api
+   cpu-idle-cooling
+   sysfs-api
+   power_allocator
+
+   exynos_thermal
+   exynos_thermal_emulation
+   nouveau_thermal
+   x86_pkg_temperature_thermal
+   intel_dptf
diff --git a/Documentation/driver-api/thermal/intel_dptf.rst b/Documentation/driver-api/thermal/intel_dptf.rst
new file mode 100644
index 000000000..4adfa1eb7
--- /dev/null
+++ b/Documentation/driver-api/thermal/intel_dptf.rst
@@ -0,0 +1,437 @@
+.. SPDX-License-Identifier: GPL-2.0
+
+===============================================================
+Intel(R) Dynamic Platform and Thermal Framework Sysfs Interface
+===============================================================
+
+:Copyright: © 2022 Intel Corporation
+
+:Author: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
+
+Introduction
+------------
+
+Intel(R) Dynamic Platform and Thermal Framework (DPTF) is a platform
+level hardware/software solution for power and thermal management.
+
+As a container for multiple power/thermal technologies, DPTF provides
+a coordinated approach for different policies to effect the hardware
+state of a system.
+
+Since it is a platform level framework, this has several components.
+Some parts of the technology is implemented in the firmware and uses
+ACPI and PCI devices to expose various features for monitoring and
+control. Linux has a set of kernel drivers exposing hardware interface
+to user space. This allows user space thermal solutions like
+"Linux Thermal Daemon" to read platform specific thermal and power
+tables to deliver adequate performance while keeping the system under
+thermal limits.
+
+DPTF ACPI Drivers interface
+----------------------------
+
+:file:`/sys/bus/platform/devices/<N>/uuids`, where <N>
+=INT3400|INTC1040|INTC1041|INTC10A0
+
+``available_uuids`` (RO)
+	A set of UUIDs strings presenting available policies
+	which should be notified to the firmware when the
+	user space can support those policies.
+
+	UUID strings:
+
+	"42A441D6-AE6A-462b-A84B-4A8CE79027D3" : Passive 1
+
+	"3A95C389-E4B8-4629-A526-C52C88626BAE" : Active
+
+	"97C68AE7-15FA-499c-B8C9-5DA81D606E0A" : Critical
+
+	"63BE270F-1C11-48FD-A6F7-3AF253FF3E2D" : Adaptive performance
+
+	"5349962F-71E6-431D-9AE8-0A635B710AEE" : Emergency call
+
+	"9E04115A-AE87-4D1C-9500-0F3E340BFE75" : Passive 2
+
+	"F5A35014-C209-46A4-993A-EB56DE7530A1" : Power Boss
+
+	"6ED722A7-9240-48A5-B479-31EEF723D7CF" : Virtual Sensor
+
+	"16CAF1B7-DD38-40ED-B1C1-1B8A1913D531" : Cooling mode
+
+	"BE84BABF-C4D4-403D-B495-3128FD44dAC1" : HDC
+
+``current_uuid`` (RW)
+	User space can write strings from available UUIDs, one at a
+	time.
+
+:file:`/sys/bus/platform/devices/<N>/`, where <N>
+=INT3400|INTC1040|INTC1041|INTC10A0
+
+``imok`` (WO)
+	User space daemon write 1 to respond to firmware event
+	for sending keep alive notification. User space receives
+	THERMAL_EVENT_KEEP_ALIVE kobject uevent notification when
+	firmware calls for user space to respond with imok ACPI
+	method.
+
+``odvp*`` (RO)
+	Firmware thermal status variable values. Thermal tables
+	calls for different processing based on these variable
+	values.
+
+``data_vault`` (RO)
+	Binary thermal table. Refer to
+	https:/github.com/intel/thermal_daemon for decoding
+	thermal table.
+
+``production_mode`` (RO)
+	When different from zero, manufacturer locked thermal configuration
+	from further changes.
+
+ACPI Thermal Relationship table interface
+------------------------------------------
+
+:file:`/dev/acpi_thermal_rel`
+
+	This device provides IOCTL interface to read standard ACPI
+	thermal relationship tables via ACPI methods _TRT and _ART.
+	These IOCTLs are defined in
+	drivers/thermal/intel/int340x_thermal/acpi_thermal_rel.h
+
+	IOCTLs:
+
+	ACPI_THERMAL_GET_TRT_LEN: Get length of TRT table
+
+	ACPI_THERMAL_GET_ART_LEN: Get length of ART table
+
+	ACPI_THERMAL_GET_TRT_COUNT: Number of records in TRT table
+
+	ACPI_THERMAL_GET_ART_COUNT: Number of records in ART table
+
+	ACPI_THERMAL_GET_TRT: Read binary TRT table, length to read is
+	provided via argument to ioctl().
+
+	ACPI_THERMAL_GET_ART: Read binary ART table, length to read is
+	provided via argument to ioctl().
+
+DPTF ACPI Sensor drivers
+-------------------------
+
+DPTF Sensor drivers are presented as standard thermal sysfs thermal_zone.
+
+
+DPTF ACPI Cooling drivers
+--------------------------
+
+DPTF cooling drivers are presented as standard thermal sysfs cooling_device.
+
+
+DPTF Processor thermal PCI Driver interface
+--------------------------------------------
+
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/power_limits/`
+
+Refer to Documentation/power/powercap/powercap.rst for powercap
+ABI.
+
+``power_limit_0_max_uw`` (RO)
+	Maximum powercap sysfs constraint_0_power_limit_uw for Intel RAPL
+
+``power_limit_0_step_uw`` (RO)
+	Power limit increment/decrements for Intel RAPL constraint 0 power limit
+
+``power_limit_0_min_uw`` (RO)
+	Minimum powercap sysfs constraint_0_power_limit_uw for Intel RAPL
+
+``power_limit_0_tmin_us`` (RO)
+	Minimum powercap sysfs constraint_0_time_window_us for Intel RAPL
+
+``power_limit_0_tmax_us`` (RO)
+	Maximum powercap sysfs constraint_0_time_window_us for Intel RAPL
+
+``power_limit_1_max_uw`` (RO)
+	Maximum powercap sysfs constraint_1_power_limit_uw for Intel RAPL
+
+``power_limit_1_step_uw`` (RO)
+	Power limit increment/decrements for Intel RAPL constraint 1 power limit
+
+``power_limit_1_min_uw`` (RO)
+	Minimum powercap sysfs constraint_1_power_limit_uw for Intel RAPL
+
+``power_limit_1_tmin_us`` (RO)
+	Minimum powercap sysfs constraint_1_time_window_us for Intel RAPL
+
+``power_limit_1_tmax_us`` (RO)
+	Maximum powercap sysfs constraint_1_time_window_us for Intel RAPL
+
+``power_floor_status`` (RO)
+	When set to 1, the power floor of the system in the current
+	configuration has been reached.  It needs to be reconfigured to allow
+	power to be reduced any further.
+
+``power_floor_enable`` (RW)
+	When set to 1, enable reading and notification of the power floor
+	status. Notifications are triggered for the power_floor_status
+	attribute value changes.
+
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/`
+
+``tcc_offset_degree_celsius`` (RW)
+	TCC offset from the critical temperature where hardware will throttle
+	CPU.
+
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/workload_request`
+
+``workload_available_types`` (RO)
+	Available workload types. User space can specify one of the workload type
+	it is currently executing via workload_type. For example: idle, bursty,
+	sustained etc.
+
+``workload_type`` (RW)
+	User space can specify any one of the available workload type using
+	this interface.
+
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/ptc_0_control`
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/ptc_1_control`
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/ptc_2_control`
+
+All these controls needs admin privilege to update.
+
+``enable`` (RW)
+	1 for enable, 0 for disable. Shows the current enable status of
+	platform temperature control feature. User space can enable/disable
+	hardware controls.
+
+``temperature_target`` (RW)
+	Update a new temperature target in milli degree celsius for hardware to
+	use for the temperature control.
+
+``thermal_tolerance`` (RW)
+	This attribute ranges from 0 to 7, where 0 represents
+	the most aggressive control to avoid any temperature overshoots, and
+	7 represents a more graceful approach, favoring performance even at
+	the expense of temperature overshoots.
+	Note: This level may not scale linearly. For example, a value of 3 does
+	not necessarily imply a 50% improvement in performance compared to a
+	value of 0.
+
+Given that this is platform temperature control, it is expected that a
+single user-level manager owns and manages the controls. If multiple
+user-level software applications attempt to write different targets, it
+can lead to unexpected behavior.
+
+
+DPTF Processor thermal RFIM interface
+--------------------------------------------
+
+RFIM interface allows adjustment of FIVR (Fully Integrated Voltage Regulator),
+DDR (Double Data Rate) and DLVR (Digital Linear Voltage Regulator)
+frequencies to avoid RF interference with WiFi and 5G.
+
+Switching voltage regulators (VR) generate radiated EMI or RFI at the
+fundamental frequency and its harmonics. Some harmonics may interfere
+with very sensitive wireless receivers such as Wi-Fi and cellular that
+are integrated into host systems like notebook PCs.  One of mitigation
+methods is requesting SOC integrated VR (IVR) switching frequency to a
+small % and shift away the switching noise harmonic interference from
+radio channels.  OEM or ODMs can use the driver to control SOC IVR
+operation within the range where it does not impact IVR performance.
+
+Some products use DLVR instead of FIVR as switching voltage regulator.
+In this case attributes of DLVR must be adjusted instead of FIVR.
+
+While shifting the frequencies additional clock noise can be introduced,
+which is compensated by adjusting Spread spectrum percent. This helps
+to reduce the clock noise to meet regulatory compliance. This spreading
+% increases bandwidth of signal transmission and hence reduces the
+effects of interference, noise and signal fading.
+
+DRAM devices of DDR IO interface and their power plane can generate EMI
+at the data rates. Similar to IVR control mechanism, Intel offers a
+mechanism by which DDR data rates can be changed if several conditions
+are met: there is strong RFI interference because of DDR; CPU power
+management has no other restriction in changing DDR data rates;
+PC ODMs enable this feature (real time DDR RFI Mitigation referred to as
+DDR-RFIM) for Wi-Fi from BIOS.
+
+
+FIVR attributes
+
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/fivr/`
+
+``vco_ref_code_lo`` (RW)
+	The VCO reference code is an 11-bit field and controls the FIVR
+	switching frequency. This is the 3-bit LSB field.
+
+``vco_ref_code_hi`` (RW)
+	The VCO reference code is an 11-bit field and controls the FIVR
+	switching frequency. This is the 8-bit MSB field.
+
+``spread_spectrum_pct`` (RW)
+	Set the FIVR spread spectrum clocking percentage
+
+``spread_spectrum_clk_enable`` (RW)
+	Enable/disable of the FIVR spread spectrum clocking feature
+
+``rfi_vco_ref_code`` (RW)
+	This field is a read only status register which reflects the
+	current FIVR switching frequency
+
+``fivr_fffc_rev`` (RW)
+	This field indicated the revision of the FIVR HW.
+
+
+DVFS attributes
+
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/dvfs/`
+
+``rfi_restriction_run_busy`` (RW)
+	Request the restriction of specific DDR data rate and set this
+	value 1. Self reset to 0 after operation.
+
+``rfi_restriction_err_code`` (RW)
+	0 :Request is accepted, 1:Feature disabled,
+	2: the request restricts more points than it is allowed
+
+``rfi_restriction_data_rate_Delta`` (RW)
+	Restricted DDR data rate for RFI protection: Lower Limit
+
+``rfi_restriction_data_rate_Base`` (RW)
+	Restricted DDR data rate for RFI protection: Upper Limit
+
+``ddr_data_rate_point_0`` (RO)
+	DDR data rate selection 1st point
+
+``ddr_data_rate_point_1`` (RO)
+	DDR data rate selection 2nd point
+
+``ddr_data_rate_point_2`` (RO)
+	DDR data rate selection 3rd point
+
+``ddr_data_rate_point_3`` (RO)
+	DDR data rate selection 4th point
+
+``rfi_disable (RW)``
+	Disable DDR rate change feature
+
+DLVR attributes
+
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/dlvr/`
+
+``dlvr_hardware_rev`` (RO)
+	DLVR hardware revision.
+
+``dlvr_freq_mhz`` (RO)
+	Current DLVR PLL frequency in MHz.
+
+``dlvr_freq_select`` (RW)
+	Sets DLVR PLL clock frequency. Once set, and enabled via
+	dlvr_rfim_enable, the dlvr_freq_mhz will show the current
+	DLVR PLL frequency.
+
+``dlvr_pll_busy`` (RO)
+	PLL can't accept frequency change when set.
+
+``dlvr_rfim_enable`` (RW)
+	0: Disable RF frequency hopping, 1: Enable RF frequency hopping.
+
+``dlvr_spread_spectrum_pct`` (RW)
+	Sets DLVR spread spectrum percent value.
+
+``dlvr_control_mode`` (RW)
+        Specifies how frequencies are spread using spread spectrum.
+        0: Down spread,
+        1: Spread in the Center.
+
+``dlvr_control_lock`` (RW)
+    1: future writes are ignored.
+
+DPTF Power supply and Battery Interface
+----------------------------------------
+
+Refer to Documentation/ABI/testing/sysfs-platform-dptf
+
+DPTF Fan Control
+----------------------------------------
+
+Refer to Documentation/admin-guide/acpi/fan_performance_states.rst
+
+Workload Type Hints
+----------------------------------------
+
+The firmware in Meteor Lake processor generation is capable of identifying
+workload type and passing hints regarding it to the OS. A special sysfs
+interface is provided to allow user space to obtain workload type hints from
+the firmware and control the rate at which they are provided.
+
+User space can poll attribute "workload_type_index" for the current hint or
+can receive a notification whenever the value of this attribute is updated.
+
+file:`/sys/bus/pci/devices/0000:00:04.0/workload_hint/`
+Segment 0, bus 0, device 4, function 0 is reserved for the processor thermal
+device on all Intel client processors. So, the above path doesn't change
+based on the processor generation.
+
+``workload_hint_enable`` (RW)
+	Enable firmware to send workload type hints to user space.
+
+``workload_slow_hint_enable`` (RW)
+	Enable firmware to send slow workload type hints to user space.
+
+``notification_delay_ms`` (RW)
+	Minimum delay in milliseconds before firmware will notify OS. This is
+	for the rate control of notifications. This delay is between changing
+	the workload type prediction in the firmware and notifying the OS about
+	the change. The default delay is 1024 ms. The delay of 0 is invalid.
+	The delay is rounded up to the nearest power of 2 to simplify firmware
+	programming of the delay value. The read of notification_delay_ms
+	attribute shows the effective value used.
+
+``workload_type_index`` (RO)
+	Predicted workload type index. User space can get notification of
+	change via existing sysfs attribute change notification mechanism.
+
+	The supported index values and their meaning for the Meteor Lake
+	processor generation are as follows:
+
+	0 -  Idle: System performs no tasks, power and idle residency are
+		consistently low for long periods of time.
+
+	1 – Battery Life: Power is relatively low, but the processor may
+		still be actively performing a task, such as video playback for
+		a long period of time.
+
+	2 – Sustained: Power level that is relatively high for a long period
+		of time, with very few to no periods of idleness, which will
+		eventually exhaust RAPL Power Limit 1 and 2.
+
+	3 – Bursty: Consumes a relatively constant average amount of power, but
+		periods of relative idleness are interrupted by bursts of
+		activity. The bursts are relatively short and the periods of
+		relative idleness between them typically prevent RAPL Power
+		Limit 1 from being exhausted.
+
+	4 – Unknown: Can't classify.
+
+	On processors starting from Panther Lake additional hints are provided.
+	The hardware analyzes workload residencies over an extended period to
+	determine whether the workload classification tends toward idle/battery
+	life states or sustained/performance states. Based on this long-term
+	analysis, it classifies:
+
+	Power Classification: If the workload exhibits more idle or battery life
+	residencies, it is classified as "power".
+
+	Performance Classification: If the workload exhibits more sustained or
+	performance residencies, it is classified as "performance".
+
+	This approach enables applications to ignore short-term workload
+	fluctuations and instead respond to longer-term power vs. performance
+	trends.
+
+	Residency thresholds for this classification are CPU generation-specific.
+	Classification is reported via bit 4 of the workload_type_index:
+
+	Bit 4 = 1: Power classification
+
+	Bit 4 = 0: Performance classification
diff --git a/Documentation/driver-api/thermal/nouveau_thermal.rst b/Documentation/driver-api/thermal/nouveau_thermal.rst
new file mode 100644
index 000000000..aa10db6df
--- /dev/null
+++ b/Documentation/driver-api/thermal/nouveau_thermal.rst
@@ -0,0 +1,96 @@
+=====================
+Kernel driver nouveau
+=====================
+
+Supported chips:
+
+* NV43+
+
+Authors: Martin Peres (mupuf) <martin.peres@free.fr>
+
+Description
+-----------
+
+This driver allows to read the GPU core temperature, drive the GPU fan and
+set temperature alarms.
+
+Currently, due to the absence of in-kernel API to access HWMON drivers, Nouveau
+cannot access any of the i2c external monitoring chips it may find. If you
+have one of those, temperature and/or fan management through Nouveau's HWMON
+interface is likely not to work. This document may then not cover your situation
+entirely.
+
+Temperature management
+----------------------
+
+Temperature is exposed under as a read-only HWMON attribute temp1_input.
+
+In order to protect the GPU from overheating, Nouveau supports 4 configurable
+temperature thresholds:
+
+ * Fan_boost:
+	Fan speed is set to 100% when reaching this temperature;
+ * Downclock:
+	The GPU will be downclocked to reduce its power dissipation;
+ * Critical:
+	The GPU is put on hold to further lower power dissipation;
+ * Shutdown:
+	Shut the computer down to protect your GPU.
+
+WARNING:
+	Some of these thresholds may not be used by Nouveau depending
+	on your chipset.
+
+The default value for these thresholds comes from the GPU's vbios. These
+thresholds can be configured thanks to the following HWMON attributes:
+
+ * Fan_boost: temp1_auto_point1_temp and temp1_auto_point1_temp_hyst;
+ * Downclock: temp1_max and temp1_max_hyst;
+ * Critical: temp1_crit and temp1_crit_hyst;
+ * Shutdown: temp1_emergency and temp1_emergency_hyst.
+
+NOTE: Remember that the values are stored as milli degrees Celsius. Don't forget
+to multiply!
+
+Fan management
+--------------
+
+Not all cards have a drivable fan. If you do, then the following HWMON
+attributes should be available:
+
+ * pwm1_enable:
+	Current fan management mode (NONE, MANUAL or AUTO);
+ * pwm1:
+	Current PWM value (power percentage);
+ * pwm1_min:
+	The minimum PWM speed allowed;
+ * pwm1_max:
+	The maximum PWM speed allowed (bypassed when hitting Fan_boost);
+
+You may also have the following attribute:
+
+ * fan1_input:
+	Speed in RPM of your fan.
+
+Your fan can be driven in different modes:
+
+ * 0: The fan is left untouched;
+ * 1: The fan can be driven in manual (use pwm1 to change the speed);
+ * 2; The fan is driven automatically depending on the temperature.
+
+NOTE:
+  Be sure to use the manual mode if you want to drive the fan speed manually
+
+NOTE2:
+  When operating in manual mode outside the vbios-defined
+  [PWM_min, PWM_max] range, the reported fan speed (RPM) may not be accurate
+  depending on your hardware.
+
+Bug reports
+-----------
+
+Thermal management on Nouveau is new and may not work on all cards. If you have
+inquiries, please ping mupuf on IRC (#nouveau, OFTC).
+
+Bug reports should be filled on Freedesktop's bug tracker. Please follow
+https://nouveau.freedesktop.org/wiki/Bugs
diff --git a/Documentation/driver-api/thermal/power_allocator.rst b/Documentation/driver-api/thermal/power_allocator.rst
new file mode 100644
index 000000000..aa5f66552
--- /dev/null
+++ b/Documentation/driver-api/thermal/power_allocator.rst
@@ -0,0 +1,281 @@
+=================================
+Power allocator governor tunables
+=================================
+
+Trip points
+-----------
+
+The governor works optimally with the following two passive trip points:
+
+1.  "switch on" trip point: temperature above which the governor
+    control loop starts operating.  This is the first passive trip
+    point of the thermal zone.
+
+2.  "desired temperature" trip point: it should be higher than the
+    "switch on" trip point.  This the target temperature the governor
+    is controlling for.  This is the last passive trip point of the
+    thermal zone.
+
+PID Controller
+--------------
+
+The power allocator governor implements a
+Proportional-Integral-Derivative controller (PID controller) with
+temperature as the control input and power as the controlled output:
+
+    P_max = k_p * e + k_i * err_integral + k_d * diff_err + sustainable_power
+
+where
+   -  e = desired_temperature - current_temperature
+   -  err_integral is the sum of previous errors
+   -  diff_err = e - previous_error
+
+It is similar to the one depicted below::
+
+				      k_d
+				       |
+  current_temp                         |
+       |                               v
+       |              +----------+   +---+
+       |       +----->| diff_err |-->| X |------+
+       |       |      +----------+   +---+      |
+       |       |                                |      tdp        actor
+       |       |                      k_i       |       |  get_requested_power()
+       |       |                       |        |       |        |     |
+       |       |                       |        |       |        |     | ...
+       v       |                       v        v       v        v     v
+     +---+     |      +-------+      +---+    +---+   +---+   +----------+
+     | S |-----+----->| sum e |----->| X |--->| S |-->| S |-->|power     |
+     +---+     |      +-------+      +---+    +---+   +---+   |allocation|
+       ^       |                                ^             +----------+
+       |       |                                |                |     |
+       |       |        +---+                   |                |     |
+       |       +------->| X |-------------------+                v     v
+       |                +---+                               granted performance
+  desired_temperature     ^
+			  |
+			  |
+		      k_po/k_pu
+
+Sustainable power
+-----------------
+
+An estimate of the sustainable dissipatable power (in mW) should be
+provided while registering the thermal zone.  This estimates the
+sustained power that can be dissipated at the desired control
+temperature.  This is the maximum sustained power for allocation at
+the desired maximum temperature.  The actual sustained power can vary
+for a number of reasons.  The closed loop controller will take care of
+variations such as environmental conditions, and some factors related
+to the speed-grade of the silicon.  `sustainable_power` is therefore
+simply an estimate, and may be tuned to affect the aggressiveness of
+the thermal ramp. For reference, the sustainable power of a 4" phone
+is typically 2000mW, while on a 10" tablet is around 4500mW (may vary
+depending on screen size). It is possible to have the power value
+expressed in an abstract scale. The sustained power should be aligned
+to the scale used by the related cooling devices.
+
+If you are using device tree, do add it as a property of the
+thermal-zone.  For example::
+
+	thermal-zones {
+		soc_thermal {
+			polling-delay = <1000>;
+			polling-delay-passive = <100>;
+			sustainable-power = <2500>;
+			...
+
+Instead, if the thermal zone is registered from the platform code, pass a
+`thermal_zone_params` that has a `sustainable_power`.  If no
+`thermal_zone_params` were being passed, then something like below
+will suffice::
+
+	static const struct thermal_zone_params tz_params = {
+		.sustainable_power = 3500,
+	};
+
+and then pass `tz_params` as the 5th parameter to
+`thermal_zone_device_register()`
+
+k_po and k_pu
+-------------
+
+The implementation of the PID controller in the power allocator
+thermal governor allows the configuration of two proportional term
+constants: `k_po` and `k_pu`.  `k_po` is the proportional term
+constant during temperature overshoot periods (current temperature is
+above "desired temperature" trip point).  Conversely, `k_pu` is the
+proportional term constant during temperature undershoot periods
+(current temperature below "desired temperature" trip point).
+
+These controls are intended as the primary mechanism for configuring
+the permitted thermal "ramp" of the system.  For instance, a lower
+`k_pu` value will provide a slower ramp, at the cost of capping
+available capacity at a low temperature.  On the other hand, a high
+value of `k_pu` will result in the governor granting very high power
+while temperature is low, and may lead to temperature overshooting.
+
+The default value for `k_pu` is::
+
+    2 * sustainable_power / (desired_temperature - switch_on_temp)
+
+This means that at `switch_on_temp` the output of the controller's
+proportional term will be 2 * `sustainable_power`.  The default value
+for `k_po` is::
+
+    sustainable_power / (desired_temperature - switch_on_temp)
+
+Focusing on the proportional and feed forward values of the PID
+controller equation we have::
+
+    P_max = k_p * e + sustainable_power
+
+The proportional term is proportional to the difference between the
+desired temperature and the current one.  When the current temperature
+is the desired one, then the proportional component is zero and
+`P_max` = `sustainable_power`.  That is, the system should operate in
+thermal equilibrium under constant load.  `sustainable_power` is only
+an estimate, which is the reason for closed-loop control such as this.
+
+Expanding `k_pu` we get::
+
+    P_max = 2 * sustainable_power * (T_set - T) / (T_set - T_on) +
+	sustainable_power
+
+where:
+
+    - T_set is the desired temperature
+    - T is the current temperature
+    - T_on is the switch on temperature
+
+When the current temperature is the switch_on temperature, the above
+formula becomes::
+
+    P_max = 2 * sustainable_power * (T_set - T_on) / (T_set - T_on) +
+	sustainable_power = 2 * sustainable_power + sustainable_power =
+	3 * sustainable_power
+
+Therefore, the proportional term alone linearly decreases power from
+3 * `sustainable_power` to `sustainable_power` as the temperature
+rises from the switch on temperature to the desired temperature.
+
+k_i and integral_cutoff
+-----------------------
+
+`k_i` configures the PID loop's integral term constant.  This term
+allows the PID controller to compensate for long term drift and for
+the quantized nature of the output control: cooling devices can't set
+the exact power that the governor requests.  When the temperature
+error is below `integral_cutoff`, errors are accumulated in the
+integral term.  This term is then multiplied by `k_i` and the result
+added to the output of the controller.  Typically `k_i` is set low (1
+or 2) and `integral_cutoff` is 0.
+
+k_d
+---
+
+`k_d` configures the PID loop's derivative term constant.  It's
+recommended to leave it as the default: 0.
+
+Cooling device power API
+========================
+
+Cooling devices controlled by this governor must supply the additional
+"power" API in their `cooling_device_ops`.  It consists on three ops:
+
+1. ::
+
+    int get_requested_power(struct thermal_cooling_device *cdev,
+			    struct thermal_zone_device *tz, u32 *power);
+
+
+@cdev:
+	The `struct thermal_cooling_device` pointer
+@tz:
+	thermal zone in which we are currently operating
+@power:
+	pointer in which to store the calculated power
+
+`get_requested_power()` calculates the power requested by the device
+in milliwatts and stores it in @power .  It should return 0 on
+success, -E* on failure.  This is currently used by the power
+allocator governor to calculate how much power to give to each cooling
+device.
+
+2. ::
+
+	int state2power(struct thermal_cooling_device *cdev, struct
+			thermal_zone_device *tz, unsigned long state,
+			u32 *power);
+
+@cdev:
+	The `struct thermal_cooling_device` pointer
+@tz:
+	thermal zone in which we are currently operating
+@state:
+	A cooling device state
+@power:
+	pointer in which to store the equivalent power
+
+Convert cooling device state @state into power consumption in
+milliwatts and store it in @power.  It should return 0 on success, -E*
+on failure.  This is currently used by thermal core to calculate the
+maximum power that an actor can consume.
+
+3. ::
+
+	int power2state(struct thermal_cooling_device *cdev, u32 power,
+			unsigned long *state);
+
+@cdev:
+	The `struct thermal_cooling_device` pointer
+@power:
+	power in milliwatts
+@state:
+	pointer in which to store the resulting state
+
+Calculate a cooling device state that would make the device consume at
+most @power mW and store it in @state.  It should return 0 on success,
+-E* on failure.  This is currently used by the thermal core to convert
+a given power set by the power allocator governor to a state that the
+cooling device can set.  It is a function because this conversion may
+depend on external factors that may change so this function should the
+best conversion given "current circumstances".
+
+Cooling device weights
+----------------------
+
+Weights are a mechanism to bias the allocation among cooling
+devices.  They express the relative power efficiency of different
+cooling devices.  Higher weight can be used to express higher power
+efficiency.  Weighting is relative such that if each cooling device
+has a weight of one they are considered equal.  This is particularly
+useful in heterogeneous systems where two cooling devices may perform
+the same kind of compute, but with different efficiency.  For example,
+a system with two different types of processors.
+
+If the thermal zone is registered using
+`thermal_zone_device_register()` (i.e., platform code), then weights
+are passed as part of the thermal zone's `thermal_bind_parameters`.
+If the platform is registered using device tree, then they are passed
+as the `contribution` property of each map in the `cooling-maps` node.
+
+Limitations of the power allocator governor
+===========================================
+
+The power allocator governor's PID controller works best if there is a
+periodic tick.  If you have a driver that calls
+`thermal_zone_device_update()` (or anything that ends up calling the
+governor's `throttle()` function) repetitively, the governor response
+won't be very good.  Note that this is not particular to this
+governor, step-wise will also misbehave if you call its throttle()
+faster than the normal thermal framework tick (due to interrupts for
+example) as it will overreact.
+
+Energy Model requirements
+=========================
+
+Another important thing is the consistent scale of the power values
+provided by the cooling devices. All of the cooling devices in a single
+thermal zone should have power values reported either in milli-Watts
+or scaled to the same 'abstract scale'.
diff --git a/Documentation/driver-api/thermal/sysfs-api.rst b/Documentation/driver-api/thermal/sysfs-api.rst
new file mode 100644
index 000000000..f73de211b
--- /dev/null
+++ b/Documentation/driver-api/thermal/sysfs-api.rst
@@ -0,0 +1,433 @@
+===================================
+Generic Thermal Sysfs driver How To
+===================================
+
+Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
+
+Copyright (c)  2008 Intel Corporation
+
+
+0. Introduction
+===============
+
+The generic thermal sysfs provides a set of interfaces for thermal zone
+devices (sensors) and thermal cooling devices (fan, processor...) to register
+with the thermal management solution and to be a part of it.
+
+This how-to focuses on enabling new thermal zone and cooling devices to
+participate in thermal management.
+This solution is platform independent and any type of thermal zone devices
+and cooling devices should be able to make use of the infrastructure.
+
+The main task of the thermal sysfs driver is to expose thermal zone attributes
+as well as cooling device attributes to the user space.
+An intelligent thermal management application can make decisions based on
+inputs from thermal zone attributes (the current temperature and trip point
+temperature) and throttle appropriate devices.
+
+- `[0-*]`	denotes any positive number starting from 0
+- `[1-*]`	denotes any positive number starting from 1
+
+1. thermal sysfs driver interface functions
+===========================================
+
+1.1 thermal zone device interface
+---------------------------------
+
+    ::
+
+	struct thermal_zone_device *
+	thermal_zone_device_register_with_trips(const char *type,
+					const struct thermal_trip *trips,
+					int num_trips, void *devdata,
+					const struct thermal_zone_device_ops *ops,
+					const struct thermal_zone_params *tzp,
+					unsigned int passive_delay,
+					unsigned int polling_delay)
+
+    This interface function adds a new thermal zone device (sensor) to the
+    /sys/class/thermal folder as `thermal_zone[0-*]`. It tries to bind all the
+    thermal cooling devices registered to it at the same time.
+
+    type:
+	the thermal zone type.
+    trips:
+	the table of trip points for this thermal zone.
+    devdata:
+	device private data
+    ops:
+	thermal zone device call-backs.
+
+	.should_bind:
+		check whether or not a given cooling device should be bound to
+		a given trip point in this thermal zone.
+	.get_temp:
+		get the current temperature of the thermal zone.
+	.set_trips:
+		set the trip points window. Whenever the current temperature
+		is updated, the trip points immediately below and above the
+		current temperature are found.
+	.change_mode:
+		change the mode (enabled/disabled) of the thermal zone.
+	.set_trip_temp:
+		set the temperature of a given trip point.
+	.get_crit_temp:
+		get the critical temperature for this thermal zone.
+	.set_emul_temp:
+		set the emulation temperature which helps in debugging
+		different threshold temperature points.
+	.get_trend:
+		get the trend of most recent zone temperature changes.
+	.hot:
+		hot trip point crossing handler.
+	.critical:
+		critical trip point crossing handler.
+    tzp:
+	thermal zone platform parameters.
+    passive_delay:
+	number of milliseconds to wait between polls when performing passive
+	cooling.
+    polling_delay:
+	number of milliseconds to wait between polls when checking
+	whether trip points have been crossed (0 for interrupt driven systems).
+
+    ::
+
+	void thermal_zone_device_unregister(struct thermal_zone_device *tz)
+
+    This interface function removes the thermal zone device.
+    It deletes the corresponding entry from /sys/class/thermal folder and
+    unbinds all the thermal cooling devices it uses.
+
+	::
+
+	   struct thermal_zone_device
+	   *thermal_zone_of_sensor_register(struct device *dev, int sensor_id,
+				void *data,
+				const struct thermal_zone_of_device_ops *ops)
+
+	This interface adds a new sensor to a DT thermal zone.
+	This function will search the list of thermal zones described in
+	device tree and look for the zone that refer to the sensor device
+	pointed by dev->of_node as temperature providers. For the zone
+	pointing to the sensor node, the sensor will be added to the DT
+	thermal zone device.
+
+	The parameters for this interface are:
+
+	dev:
+			Device node of sensor containing valid node pointer in
+			dev->of_node.
+	sensor_id:
+			a sensor identifier, in case the sensor IP has more
+			than one sensors
+	data:
+			a private pointer (owned by the caller) that will be
+			passed back, when a temperature reading is needed.
+	ops:
+			`struct thermal_zone_of_device_ops *`.
+
+			==============  =======================================
+			get_temp	a pointer to a function that reads the
+					sensor temperature. This is mandatory
+					callback provided by sensor driver.
+			set_trips	a pointer to a function that sets a
+					temperature window. When this window is
+					left the driver must inform the thermal
+					core via thermal_zone_device_update.
+			get_trend 	a pointer to a function that reads the
+					sensor temperature trend.
+			set_emul_temp	a pointer to a function that sets
+					sensor emulated temperature.
+			==============  =======================================
+
+	The thermal zone temperature is provided by the get_temp() function
+	pointer of thermal_zone_of_device_ops. When called, it will
+	have the private pointer @data back.
+
+	It returns error pointer if fails otherwise valid thermal zone device
+	handle. Caller should check the return handle with IS_ERR() for finding
+	whether success or not.
+
+	::
+
+	    void thermal_zone_of_sensor_unregister(struct device *dev,
+						   struct thermal_zone_device *tzd)
+
+	This interface unregisters a sensor from a DT thermal zone which was
+	successfully added by interface thermal_zone_of_sensor_register().
+	This function removes the sensor callbacks and private data from the
+	thermal zone device registered with thermal_zone_of_sensor_register()
+	interface. It will also silent the zone by remove the .get_temp() and
+	get_trend() thermal zone device callbacks.
+
+	::
+
+	  struct thermal_zone_device
+	  *devm_thermal_zone_of_sensor_register(struct device *dev,
+				int sensor_id,
+				void *data,
+				const struct thermal_zone_of_device_ops *ops)
+
+	This interface is resource managed version of
+	thermal_zone_of_sensor_register().
+
+	All details of thermal_zone_of_sensor_register() described in
+	section 1.1.3 is applicable here.
+
+	The benefit of using this interface to register sensor is that it
+	is not require to explicitly call thermal_zone_of_sensor_unregister()
+	in error path or during driver unbinding as this is done by driver
+	resource manager.
+
+	::
+
+		void devm_thermal_zone_of_sensor_unregister(struct device *dev,
+						struct thermal_zone_device *tzd)
+
+	This interface is resource managed version of
+	thermal_zone_of_sensor_unregister().
+	All details of thermal_zone_of_sensor_unregister() described in
+	section 1.1.4 is applicable here.
+	Normally this function will not need to be called and the resource
+	management code will ensure that the resource is freed.
+
+	::
+
+		int thermal_zone_get_slope(struct thermal_zone_device *tz)
+
+	This interface is used to read the slope attribute value
+	for the thermal zone device, which might be useful for platform
+	drivers for temperature calculations.
+
+	::
+
+		int thermal_zone_get_offset(struct thermal_zone_device *tz)
+
+	This interface is used to read the offset attribute value
+	for the thermal zone device, which might be useful for platform
+	drivers for temperature calculations.
+
+1.2 thermal cooling device interface
+------------------------------------
+
+
+    ::
+
+	struct thermal_cooling_device
+	*thermal_cooling_device_register(char *name,
+			void *devdata, struct thermal_cooling_device_ops *)
+
+    This interface function adds a new thermal cooling device (fan/processor/...)
+    to /sys/class/thermal/ folder as `cooling_device[0-*]`. It tries to bind itself
+    to all the thermal zone devices registered at the same time.
+
+    name:
+	the cooling device name.
+    devdata:
+	device private data.
+    ops:
+	thermal cooling devices call-backs.
+
+	.get_max_state:
+		get the Maximum throttle state of the cooling device.
+	.get_cur_state:
+		get the Currently requested throttle state of the
+		cooling device.
+	.set_cur_state:
+		set the Current throttle state of the cooling device.
+
+    ::
+
+	void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
+
+    This interface function removes the thermal cooling device.
+    It deletes the corresponding entry from /sys/class/thermal folder and
+    unbinds itself from all the thermal zone devices using it.
+
+1.4 Thermal Zone Parameters
+---------------------------
+
+    ::
+
+	struct thermal_zone_params
+
+    This structure defines the platform level parameters for a thermal zone.
+    This data, for each thermal zone should come from the platform layer.
+    This is an optional feature where some platforms can choose not to
+    provide this data.
+
+    .governor_name:
+	       Name of the thermal governor used for this zone
+    .no_hwmon:
+	       a boolean to indicate if the thermal to hwmon sysfs interface
+	       is required. when no_hwmon == false, a hwmon sysfs interface
+	       will be created. when no_hwmon == true, nothing will be done.
+	       In case the thermal_zone_params is NULL, the hwmon interface
+	       will be created (for backward compatibility).
+
+2. sysfs attributes structure
+=============================
+
+==	================
+RO	read only value
+WO	write only value
+RW	read/write value
+==	================
+
+Thermal sysfs attributes will be represented under /sys/class/thermal.
+Hwmon sysfs I/F extension is also available under /sys/class/hwmon
+if hwmon is compiled in or built as a module.
+
+Thermal zone device sys I/F, created once it's registered::
+
+  /sys/class/thermal/thermal_zone[0-*]:
+    |---type:			Type of the thermal zone
+    |---temp:			Current temperature
+    |---mode:			Working mode of the thermal zone
+    |---policy:			Thermal governor used for this zone
+    |---available_policies:	Available thermal governors for this zone
+    |---trip_point_[0-*]_temp:	Trip point temperature
+    |---trip_point_[0-*]_type:	Trip point type
+    |---trip_point_[0-*]_hyst:	Hysteresis value for this trip point
+    |---emul_temp:		Emulated temperature set node
+    |---sustainable_power:      Sustainable dissipatable power
+    |---k_po:                   Proportional term during temperature overshoot
+    |---k_pu:                   Proportional term during temperature undershoot
+    |---k_i:                    PID's integral term in the power allocator gov
+    |---k_d:                    PID's derivative term in the power allocator
+    |---integral_cutoff:        Offset above which errors are accumulated
+    |---slope:                  Slope constant applied as linear extrapolation
+    |---offset:                 Offset constant applied as linear extrapolation
+
+Thermal cooling device sys I/F, created once it's registered::
+
+  /sys/class/thermal/cooling_device[0-*]:
+    |---type:			Type of the cooling device(processor/fan/...)
+    |---max_state:		Maximum cooling state of the cooling device
+    |---cur_state:		Current cooling state of the cooling device
+    |---stats:			Directory containing cooling device's statistics
+    |---stats/reset:		Writing any value resets the statistics
+    |---stats/time_in_state_ms:	Time (msec) spent in various cooling states
+    |---stats/total_trans:	Total number of times cooling state is changed
+    |---stats/trans_table:	Cooling state transition table
+
+
+Then next two dynamic attributes are created/removed in pairs. They represent
+the relationship between a thermal zone and its associated cooling device.
+
+::
+
+  /sys/class/thermal/thermal_zone[0-*]:
+    |---cdev[0-*]:		[0-*]th cooling device in current thermal zone
+    |---cdev[0-*]_trip_point:	Trip point that cdev[0-*] is associated with
+    |---cdev[0-*]_weight:       Influence of the cooling device in
+				this thermal zone
+
+Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
+the generic thermal driver also creates a hwmon sysfs I/F for each _type_
+of thermal zone device. E.g. the generic thermal driver registers one hwmon
+class device and build the associated hwmon sysfs I/F for all the registered
+ACPI thermal zones.
+
+Please read Documentation/ABI/testing/sysfs-class-thermal for thermal
+zone and cooling device attribute details.
+
+::
+
+  /sys/class/hwmon/hwmon[0-*]:
+    |---name:			The type of the thermal zone devices
+    |---temp[1-*]_input:	The current temperature of thermal zone [1-*]
+    |---temp[1-*]_critical:	The critical trip point of thermal zone [1-*]
+
+Please read Documentation/hwmon/sysfs-interface.rst for additional information.
+
+3. A simple implementation
+==========================
+
+ACPI thermal zone may support multiple trip points like critical, hot,
+passive, active. If an ACPI thermal zone supports critical, passive,
+active[0] and active[1] at the same time, it may register itself as a
+thermal_zone_device (thermal_zone1) with 4 trip points in all.
+It has one processor and one fan, which are both registered as
+thermal_cooling_device. Both are considered to have the same
+effectiveness in cooling the thermal zone.
+
+If the processor is listed in _PSL method, and the fan is listed in _AL0
+method, the sys I/F structure will be built like this::
+
+ /sys/class/thermal:
+  |thermal_zone1:
+    |---type:			acpitz
+    |---temp:			37000
+    |---mode:			enabled
+    |---policy:			step_wise
+    |---available_policies:	step_wise fair_share
+    |---trip_point_0_temp:	100000
+    |---trip_point_0_type:	critical
+    |---trip_point_1_temp:	80000
+    |---trip_point_1_type:	passive
+    |---trip_point_2_temp:	70000
+    |---trip_point_2_type:	active0
+    |---trip_point_3_temp:	60000
+    |---trip_point_3_type:	active1
+    |---cdev0:			--->/sys/class/thermal/cooling_device0
+    |---cdev0_trip_point:	1	/* cdev0 can be used for passive */
+    |---cdev0_weight:           1024
+    |---cdev1:			--->/sys/class/thermal/cooling_device3
+    |---cdev1_trip_point:	2	/* cdev1 can be used for active[0]*/
+    |---cdev1_weight:           1024
+
+  |cooling_device0:
+    |---type:			Processor
+    |---max_state:		8
+    |---cur_state:		0
+
+  |cooling_device3:
+    |---type:			Fan
+    |---max_state:		2
+    |---cur_state:		0
+
+ /sys/class/hwmon:
+  |hwmon0:
+    |---name:			acpitz
+    |---temp1_input:		37000
+    |---temp1_crit:		100000
+
+4. Export Symbol APIs
+=====================
+
+4.1. get_tz_trend
+-----------------
+
+This function returns the trend of a thermal zone, i.e the rate of change
+of temperature of the thermal zone. Ideally, the thermal sensor drivers
+are supposed to implement the callback. If they don't, the thermal
+framework calculated the trend by comparing the previous and the current
+temperature values.
+
+4.2. thermal_cdev_update
+------------------------
+
+This function serves as an arbitrator to set the state of a cooling
+device. It sets the cooling device to the deepest cooling state if
+possible.
+
+5. Critical Events
+==================
+
+On an event of critical trip temperature crossing, the thermal framework
+will trigger a hardware protection power-off (shutdown) or reboot,
+depending on configuration.
+
+At first, the kernel will attempt an orderly power-off or reboot, but
+accepts a delay after which it proceeds to do a forced power-off or
+reboot, respectively. If this fails, ``emergency_restart()`` is invoked
+as last resort.
+
+The delay should be carefully profiled so as to give adequate time for
+orderly power-off or reboot.
+
+If the delay is set to 0, the emergency action will not be supported. So a
+carefully profiled non-zero positive value is a must for the emergency
+action to be triggered.
diff --git a/Documentation/driver-api/thermal/x86_pkg_temperature_thermal.rst b/Documentation/driver-api/thermal/x86_pkg_temperature_thermal.rst
new file mode 100644
index 000000000..2ac42ccd2
--- /dev/null
+++ b/Documentation/driver-api/thermal/x86_pkg_temperature_thermal.rst
@@ -0,0 +1,55 @@
+===================================
+Kernel driver: x86_pkg_temp_thermal
+===================================
+
+Supported chips:
+
+* x86: with package level thermal management
+
+(Verify using: CPUID.06H:EAX[bit 6] =1)
+
+Authors: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
+
+Reference
+---------
+
+Intel® 64 and IA-32 Architectures Software Developer’s Manual (Jan, 2013):
+Chapter 14.6: PACKAGE LEVEL THERMAL MANAGEMENT
+
+Description
+-----------
+
+This driver register CPU digital temperature package level sensor as a thermal
+zone with maximum two user mode configurable trip points. Number of trip points
+depends on the capability of the package. Once the trip point is violated,
+user mode can receive notification via thermal notification mechanism and can
+take any action to control temperature.
+
+
+Threshold management
+--------------------
+Each package will register as a thermal zone under /sys/class/thermal.
+
+Example::
+
+	/sys/class/thermal/thermal_zone1
+
+This contains two trip points:
+
+- trip_point_0_temp
+- trip_point_1_temp
+
+User can set any temperature between 0 to TJ-Max temperature. Temperature units
+are in milli-degree Celsius. Refer to "Documentation/driver-api/thermal/sysfs-api.rst" for
+thermal sys-fs details.
+
+Any value other than 0 in these trip points, can trigger thermal notifications.
+Setting 0, stops sending thermal notifications.
+
+Thermal notifications:
+To get kobject-uevent notifications, set the thermal zone
+policy to "user_space".
+
+For example::
+
+	echo -n "user_space" > policy