staging: rtl8723bs: fix OOB read in rtw_action_frame_parse()grafted

rtw_action_frame_parse() takes a frame_len parameter but never
actually checks it before indexing into the frame body:

	const u8 *frame_body = frame + sizeof(struct ieee80211_hdr_3addr);
	...
	c = frame_body[0];
	...
	a = frame_body[1];

frame_body already points 24 bytes (sizeof(struct
ieee80211_hdr_3addr)) into frame, so reading frame_body[0] and
frame_body[1] requires frame_len >= 26. A management action frame
shorter than that (e.g. exactly 24 bytes, the minimum a malicious
peer can send) causes a 1-2 byte out-of-bounds read.

This is reachable from rtw_cfg80211_monitor_if_xmit_entry() and
cfg80211_rtw_mgmt_tx() in ioctl_cfg80211.c, both of which pass
attacker/user-influenced frame buffers and lengths straight through.

Add the missing length check before frame_body is dereferenced.

Fixes: 554c0a3abf216 ("staging: Add rtl8723bs sdio wifi driver")
Cc: stable@vger.kernel.org
Signed-off-by: Muhammad Bilal <meatuni001@gmail.com>
Link: https://patch.msgid.link/20260728125456.32359-3-meatuni001@gmail.com
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

1 files changed, 107 insertions, 0 deletions

diff --git a/Documentation/driver-api/thermal/cpu-cooling-api.rst b/Documentation/driver-api/thermal/cpu-cooling-api.rst
new file mode 100644
index 000000000..645d914c4
--- /dev/null
+++ b/Documentation/driver-api/thermal/cpu-cooling-api.rst
@@ -0,0 +1,107 @@
+=======================
+CPU cooling APIs How To
+=======================
+
+Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>
+
+Updated: 6 Jan 2015
+
+Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
+
+0. Introduction
+===============
+
+The generic cpu cooling(freq clipping) provides registration/unregistration APIs
+to the caller. The binding of the cooling devices to the trip point is left for
+the user. The registration APIs returns the cooling device pointer.
+
+1. cpu cooling APIs
+===================
+
+1.1 cpufreq registration/unregistration APIs
+--------------------------------------------
+
+    ::
+
+	struct thermal_cooling_device
+	*cpufreq_cooling_register(struct cpumask *clip_cpus)
+
+    This interface function registers the cpufreq cooling device with the name
+    "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
+    cooling devices.
+
+   clip_cpus:
+	cpumask of cpus where the frequency constraints will happen.
+
+    ::
+
+	struct thermal_cooling_device
+	*of_cpufreq_cooling_register(struct cpufreq_policy *policy)
+
+    This interface function registers the cpufreq cooling device with
+    the name "thermal-cpufreq-%x" linking it with a device tree node, in
+    order to bind it via the thermal DT code. This api can support multiple
+    instances of cpufreq cooling devices.
+
+    policy:
+	CPUFreq policy.
+
+
+    ::
+
+	void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+
+    This interface function unregisters the "thermal-cpufreq-%x" cooling device.
+
+    cdev: Cooling device pointer which has to be unregistered.
+
+2. Power models
+===============
+
+The power API registration functions provide a simple power model for
+CPUs.  The current power is calculated as dynamic power (static power isn't
+supported currently).  This power model requires that the operating-points of
+the CPUs are registered using the kernel's opp library and the
+`cpufreq_frequency_table` is assigned to the `struct device` of the
+cpu.  If you are using CONFIG_CPUFREQ_DT then the
+`cpufreq_frequency_table` should already be assigned to the cpu
+device.
+
+The dynamic power consumption of a processor depends on many factors.
+For a given processor implementation the primary factors are:
+
+- The time the processor spends running, consuming dynamic power, as
+  compared to the time in idle states where dynamic consumption is
+  negligible.  Herein we refer to this as 'utilisation'.
+- The voltage and frequency levels as a result of DVFS.  The DVFS
+  level is a dominant factor governing power consumption.
+- In running time the 'execution' behaviour (instruction types, memory
+  access patterns and so forth) causes, in most cases, a second order
+  variation.  In pathological cases this variation can be significant,
+  but typically it is of a much lesser impact than the factors above.
+
+A high level dynamic power consumption model may then be represented as::
+
+	Pdyn = f(run) * Voltage^2 * Frequency * Utilisation
+
+f(run) here represents the described execution behaviour and its
+result has a units of Watts/Hz/Volt^2 (this often expressed in
+mW/MHz/uVolt^2)
+
+The detailed behaviour for f(run) could be modelled on-line.  However,
+in practice, such an on-line model has dependencies on a number of
+implementation specific processor support and characterisation
+factors.  Therefore, in initial implementation that contribution is
+represented as a constant coefficient.  This is a simplification
+consistent with the relative contribution to overall power variation.
+
+In this simplified representation our model becomes::
+
+	Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation
+
+Where `capacitance` is a constant that represents an indicative
+running time dynamic power coefficient in fundamental units of
+mW/MHz/uVolt^2.  Typical values for mobile CPUs might lie in range
+from 100 to 500.  For reference, the approximate values for the SoC in
+ARM's Juno Development Platform are 530 for the Cortex-A57 cluster and
+140 for the Cortex-A53 cluster.