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| author | Linus Torvalds <torvalds@linux-foundation.org> | 2026-08-24 08:46:03 -0700 |
|---|---|---|
| committer | Linus Torvalds <torvalds@linux-foundation.org> | 2026-08-24 08:46:03 -0700 |
| commit | cf9610f9116d55c5a66ef9f1faecacabd93a9322 (patch) | |
| tree | 757a3d280760c654767631cab5ad8af2d86d1848 /Documentation/driver-api/thermal/cpu-cooling-api.rst | |
| download | linux-stable-cf9610f9116d55c5a66ef9f1faecacabd93a9322.tar.gz linux-stable-cf9610f9116d55c5a66ef9f1faecacabd93a9322.zip | |
Merge tag 'pinctrl-v7.3-1' of git://git.kernel.org/pub/scm/linux/kernel/git/linusw/linux-pinctrlgrafted
Pull pin control updates from Linus Walleij:
"Core changes:
- Use the non-blocking mux_state_try_select() in the generic MUX pin
control back-end
- Free pin maps on pinctrl_generic_to_map() failure in the core
helpers
New hardware pin control:
- Qualcomm Maili TLMM SoC, PMG1110 PMIC, and Eliza LPASS LPI TLMM SoC
(this is for the low power audio, LPASS = Low Power Audio SubSystem
portions)
- Upboard support on top of the Intel pin controller
- Apple T6030 and T6031 support (just compatible strings)
- Samsung Exynos 8855 SoC
- Mediatek MT6858 SoC
- Rockchip RK3308B and RV1106 SoCs
- Airoha EN7523 and AN7563 SoCs
Improvements:
- Qualcomm TLMM GPIOs are unconditionally marked as wakeup capable
- Qualcomm improvements on top of the Qualcomm PDC (power domain
controller) irqchip improvements from tglx:s tree
- Qualcomm IPQ806x and IPQ9650 non-urgent pin grop fixups
- The NPCM8xx driver has been put into shape fixing many pin and
group definitions
- Some non-urgent Tegra 264 pin assignments are fixed up
- Some non-urgent fixups to Airoha AN7581 and AN7583 registers and
pin assignments, missing features etc"
* tag 'pinctrl-v7.3-1' of git://git.kernel.org/pub/scm/linux/kernel/git/linusw/linux-pinctrl: (130 commits)
dt-bindings: pinctrl: Convert TI DA850 pupd to DT schema
pinctrl: meson: sync some modify from A4
pinctrl: meson: a4: Add input enable pin configuration
pinctrl: realtek: rtd1625: remove unused group name spdif_sel
pinctrl: realtek: rtd1625: fix base_bit for VE4 GPIO 13
dt-bindings: pinctrl: microchip,pic32mzda-pinctrl: Convert to DT schema
Revert "Merge branch 'ib-rsk7204' into devel"
pinctrl: rockchip: Add RV1106 pinctrl support
dt-bindings: pinctrl: rockchip: Add RV1106 compatible
pinctrl: rockchip: Decode drive strength in the get function
pinctrl: fix PINCTRL_GENERIC_MUX not always being selectable
pinctrl: airoha: add support of an7563 SoC
dt-bindings: pinctrl: airoha: add support of an7563 pin controller
pinctrl: airoha: try to find chip scu node by phandle first
pinctrl: airoha: add support of en7523 SoC
dt-bindings: pinctrl: airoha: add support of en7523 pin controller
pinctrl: airoha: an7583: add support for olt pinmux
pinctrl: airoha: an7583: add support for pon_alt pinmux
pinctrl: airoha: an7583: add support for npu_uart pinmux
dt-bindings: pinctrl: airoha: an7583: add missed features
...
Diffstat (limited to 'Documentation/driver-api/thermal/cpu-cooling-api.rst')
| -rw-r--r-- | Documentation/driver-api/thermal/cpu-cooling-api.rst | 107 |
1 files changed, 107 insertions, 0 deletions
diff --git a/Documentation/driver-api/thermal/cpu-cooling-api.rst b/Documentation/driver-api/thermal/cpu-cooling-api.rst new file mode 100644 index 000000000..645d914c4 --- /dev/null +++ b/Documentation/driver-api/thermal/cpu-cooling-api.rst @@ -0,0 +1,107 @@ +======================= +CPU cooling APIs How To +======================= + +Written by Amit Daniel Kachhap <amit.kachhap@linaro.org> + +Updated: 6 Jan 2015 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction +=============== + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs +=================== + +1.1 cpufreq registration/unregistration APIs +-------------------------------------------- + + :: + + struct thermal_cooling_device + *cpufreq_cooling_register(struct cpumask *clip_cpus) + + This interface function registers the cpufreq cooling device with the name + "thermal-cpufreq-%x". This api can support multiple instances of cpufreq + cooling devices. + + clip_cpus: + cpumask of cpus where the frequency constraints will happen. + + :: + + struct thermal_cooling_device + *of_cpufreq_cooling_register(struct cpufreq_policy *policy) + + This interface function registers the cpufreq cooling device with + the name "thermal-cpufreq-%x" linking it with a device tree node, in + order to bind it via the thermal DT code. This api can support multiple + instances of cpufreq cooling devices. + + policy: + CPUFreq policy. + + + :: + + void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) + + This interface function unregisters the "thermal-cpufreq-%x" cooling device. + + cdev: Cooling device pointer which has to be unregistered. + +2. Power models +=============== + +The power API registration functions provide a simple power model for +CPUs. The current power is calculated as dynamic power (static power isn't +supported currently). This power model requires that the operating-points of +the CPUs are registered using the kernel's opp library and the +`cpufreq_frequency_table` is assigned to the `struct device` of the +cpu. If you are using CONFIG_CPUFREQ_DT then the +`cpufreq_frequency_table` should already be assigned to the cpu +device. + +The dynamic power consumption of a processor depends on many factors. +For a given processor implementation the primary factors are: + +- The time the processor spends running, consuming dynamic power, as + compared to the time in idle states where dynamic consumption is + negligible. Herein we refer to this as 'utilisation'. +- The voltage and frequency levels as a result of DVFS. The DVFS + level is a dominant factor governing power consumption. +- In running time the 'execution' behaviour (instruction types, memory + access patterns and so forth) causes, in most cases, a second order + variation. In pathological cases this variation can be significant, + but typically it is of a much lesser impact than the factors above. + +A high level dynamic power consumption model may then be represented as:: + + Pdyn = f(run) * Voltage^2 * Frequency * Utilisation + +f(run) here represents the described execution behaviour and its +result has a units of Watts/Hz/Volt^2 (this often expressed in +mW/MHz/uVolt^2) + +The detailed behaviour for f(run) could be modelled on-line. However, +in practice, such an on-line model has dependencies on a number of +implementation specific processor support and characterisation +factors. Therefore, in initial implementation that contribution is +represented as a constant coefficient. This is a simplification +consistent with the relative contribution to overall power variation. + +In this simplified representation our model becomes:: + + Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation + +Where `capacitance` is a constant that represents an indicative +running time dynamic power coefficient in fundamental units of +mW/MHz/uVolt^2. Typical values for mobile CPUs might lie in range +from 100 to 500. For reference, the approximate values for the SoC in +ARM's Juno Development Platform are 530 for the Cortex-A57 cluster and +140 for the Cortex-A53 cluster. |
